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產品名稱
Product Name
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聚酰亞胺薄膜
Polyimide Film
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厚度
Thickness
(mm)
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0.0125～0.25±10%
(Upon requests)
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拉伸強度
Tensile Strength
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橫向 Min 115～165 Mpa, 縱向 Min 135～165 Mpa
Horizontal Min 115～165 Mpa, Vertical Min 135～165 Mpa
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延伸率
Elongation
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Min 35～60 %
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熱收縮率
Heat Shrinkage
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150c Max1.0 %
400c Max3.0 %
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體積電阻
Volume Resistivity 200c
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Min 1.0x10^10 (ohm.m)
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表面電阻
Surface Resistivity
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Min 1.0x10^13(ohm)
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擊穿電壓
Dielectric Breakdown Voltage 50Hz
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110～170 KV/mm
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介電常數
Permittivity 50Hz
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3.2~3.5+0.4
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損耗值正切
Loss tangent values 48~62Hz
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Min 1.8x10^-3~Min 4.0x10^-3
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產品特點
Product Features
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聚酰亞胺薄膜是世界上性能最好的薄膜類絕緣材料，由均苯四甲酸二酐（PMDA）和二胺基二苯醚（DDE）在強極性溶劑中經縮聚並流延成膜再經亞胺化而成。該膜具有優良的耐高低溫性、電氣絕緣性、粘結性、耐輻射性、耐介質性，能在－269℃～280℃的溫度範圍內長期使用，短時可達到400℃的高溫。
polyimide firm is the best thun-film type insulating material in nowadays world, using the polymerization of PMDA and DDE in strongly polar solvent, followed by cast film formation and imidization., which has a good property of resistance to heat, electrical insulation, adhesion, radioactive and chemical. It can be used in a long term during the temperature between -269℃. to 260℃.. it can also be used under 400℃. in a short term.
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備註
Notes
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以上諸技術參數為本公司採用公認可靠之檢測方法，經多次檢驗所得實測平均數據。為正確選擇公司產品，建議您基於欲使用物件先行對使用目的與條件作詳盡瞭解，或通知本公司，以便為您提供進一步說明服務。
The above technical parameter is based on company methods and average data, which have been proven reliable,. For the correct choice of products, we recommend that your recognition of the object, its purpose and working conditions, in order to provide you with further detailed de
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